Products > Backing Plates
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What is the function of a Backing Plate?
The B/P is an electrode of sputter and is a cooler for Sputtering targets in Sputtering Equipment. We ensure high electrial conductivity, good thermal conductivity and low gas release from our Backing Plates within the vacuum environment.
The Sputtering Process:
Ar gas is ionized and collides with the "target" by adding a high voltage of direct current between the base and the "targets while introducing inert gas" (mainly Ar gas) in a vacuum. The Targets are then bonded on the Backing Plate (B/P)
In all cases, the backing plates are manufactured on numerically controlled (NC) equipment to OEM specifications guaranteeing the required dimensional tolerances and absolute reproducibility. Special coatings of chromium or nickel are also available in situations in which some target material characteristics may cause a problem in connection with the backing plate base metal.
Our Process of Production:
B/P Production by the month:
Present amount of
Production by the month
About 1500 pieces / month
Chuetsu is a leading manufacturer of Backing Plates (B/P) for almost every commercially available sputtering system. The sputtering equipment is used in the production process for Semiconductor Material, Flat Panel Display, recording media and more. We manufacture a wide range of standard custom backing plates and we can manufacture customer pieces that can be designed to your specifications.
Chuetsu formally used Oxygen Free Copper but in recent years has switched to our Cr-Cu as it showed higher prevention to deformation when rising temperatures occurred during use.